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dc.contributor.authorBidadi, H
dc.contributor.authorOskui, AS
dc.contributor.authorBidadi, S
dc.date.accessioned2018-08-26T08:29:13Z
dc.date.available2018-08-26T08:29:13Z
dc.date.issued2007
dc.identifier.urihttp://dspace.tbzmed.ac.ir:8080/xmlui/handle/123456789/51737
dc.description.abstractIn this experimental work. some electronic properties of vacuum evaporated Cu/SiO2/Cu structures such as circuiting I-c and emission I-e currents versus the applied voltage, electron attenuation lengths in both copper and SiO2 layers and the role of the latter layers have been investigated. Experimental results show that these devices undergo an electroforming process leading to resistivity decrease of several orders of magnitude along with a negative resistance region in their current-voltage characteristics. By decreasing the temperature, both I-c and I-e are decreased and at low temperatures the negative resistance region disappears completely. Electron attenuation lengths are measured between 6 and 14 V for copper and SiO2 layers and their significance are discussed on the base of electron-impurity and electron-defect scatterings. The conduction mechanism is also discussed on the base of a filamentary model. (c) 2007 Elsevier B.V. All rights reserved.
dc.language.isoEnglish
dc.relation.ispartofJOURNAL OF NON-CRYSTALLINE SOLIDS
dc.relation.ispartof6th Symposium on SiO2 Advanced Dielectrics and Related Devices
dc.subjectelectrical and electronic properties
dc.subjectfilms and coatings
dc.titleElectronic properties of Cu/SiO2/Cu structures at different temperatures
dc.typeArticle; Proceedings Paper
dc.citation.volume353
dc.citation.issue6-7
dc.citation.spage653
dc.citation.epage657
dc.citation.indexWeb of science
dc.identifier.DOIhttps://doi.org/10.1016/j.jnoncrysol.2006.11.023


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